Abstract:
This paper presents the results of a combined experimental and computational study of the mechanisms of blister formation, and their effects on the degradation of organic light emitting devices （OLEDs）. Blister formation is attributed to the effects of thermally induced mismatch stresses associated with applied bias. These result in interfacial cracking phenomena that are affected by the solvents that are used in OLED
fabrication. The OLEDs are first fabricated using an electron transport layer of poly (3,4 ethylenedioxythiophene)-poly（styrenesulfonate） deposited on an active layer made from solutions of poly[2-methoxy-5-(2-ethylhexyloxy)-1,4-phenylenevinylene] dissolved in different solvents (toluene, chloroform, and chlorobenzene). The formation of blisters and degradation is then studied under applied bias for devices
fabricated using different solvents (toluene, chloroform, and chlorobenzene) and emissive layer thicknesses. The underlying layer mechanical properties are then incorporated into interfacial fracture mechanic models that explain the formation of blisters that degrade the performance of OLED structures.
